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Looking at the future of AI chips from Google TPU v4
Last week, Google published its in-depth interpretation of TPU v4 paper “TPU v4: An Optically Reconfigurable Supercomputer for Machine Learning with Hardware Support for Embeddings” on the paper preprint platform arxiv (TPU v4: reconfigurable machines through optical interconnection) ...Read more -
Cadence launches Allegro X AI
Cadence Introduces Allegro X AI, Designed to Accelerate PCB Design Process, Can Reduce Turnaround Time by More Than 10 Times Cadence Electronics (Cadence Corporation, NASDAQ: CDNS) today announced the launch of Cadence Allegro X AI technology, a next-generation system design technology from Caden...Read more -
The EU may reach a chip bill agreement
At the end of last year, the European Union officially launched the internal negotiation of the 43 billion euro “Chip Act“, hoping to solve the problem of semiconductor shortage in Europe through the 43 billion euro “Chip Act”, with the goal of increasing Europe’s sh...Read more -
Big Three of Memory Chips
According to the research data released by TrendForce yesterday, as some suppliers such as Micron and SK Hynix have started to reduce DRAM production, the average price of DRAM has dropped by nearly 20% compared with the first quarter, and the decline in the second quarter is expected to converge...Read more -
AI industry layout and semiconductor opportunities AIGC
ChatGPT was born, GPT4 is more “smart” On November 30, 2022, OpenAI, an American artificial intelligence research company, released the artificial intelligence chat robot ChatGPT, which became popular all over the world shortly after its launch. In just 5 days, the number of registere...Read more -
The split trend of the semiconductor industry is intensifying
The semiconductor industry, which is increasingly important in terms of economic security, is being divided by the Sino-U.S. rivalry. Japan and the United States, which have strong semiconductor manufacturing equipment manufacturers, will see their equipment exports to China decrease for the firs...Read more -
Device communication and integration in semiconductor
Semiconductor production is mainly divided into three major processes: design, manufacturing, and packaging and testing. A large number of production equipment are required in the two processes of manufacturing and packaging and testing, including etching, deposition, cleaning, electroplating, pa...Read more -
Japanese semiconductor equipment continues to plummet
Sales of semiconductor (chip) manufacturing equipment in Japan have shown a monthly decline for five consecutive months, and monthly sales have continued to fall below the 300 billion yen threshold, hitting an eight-month low. The Semiconductor Manufacturing Equipment Association of Japan (SEAJ) ...Read more -
Qualcomm’s strongest chip strikes of Nuvia core
We only recently stumbled upon some new spec information about the Snapdragon 8 Gen 3, and news of the Snapdragon 8 Gen 4 has already begun to circulate. For 2024, Qualcomm‘s flagship SoC should be the first to feature custom Nuvia cores. Thanks to mass production on TSMC’s N3E proces...Read more -
What is the future of chips?
When it comes to device interconnects, it’s actually hard to beat copper wire. Because of its low resistivity and high reliability, it provides the industry with excellent on-chip interconnect and chip-to-chip routing. But in logic chips, as interconnect stacks move up into the 14-level ran...Read more -
HBM, growing rapidly
According to semiconductor-digest, the global high-bandwidth memory market is expected to grow from USD 292.7 million in 2022 to USD 3,433.8 million by 2031, at a CAGR of 31.3% during the forecast period 2023-2031. This growth can be attributed to growing demand for high-performance computing, ar...Read more -
Samsung bets on advanced packaging
Samsung Electronics established the Advanced Packaging (AVP) organization in December to take charge of packaging technology and product development. The South Korean semiconductor giant announced its aim to push the limits of semiconductors with advanced packaging technology. “Our AVP busi...Read more
